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Patent Assignment Details
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Reel/Frame:013133/0226   Pages: 3
Recorded: 09/30/2002
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
10/07/2008
Application #:
10065254
Filing Dt:
09/30/2002
Publication #:
Pub Dt:
08/28/2003
Title:
ENCAPSULATION OF ELECTRONIC DEVICES WITH SHAPED SPACERS
Assignor
1
Exec Dt:
09/04/2002
Assignee
1
WERNERWERKSTRASSE 2, D-93049 REGENSBURG, GERMANY
REGENSBURG D-93049, GERMANY
Correspondence name and address
SIEMENS INTELLECTUAL PROPERTY TECHNOLOGY
CONSULTING PTE LTD
166 KALLANG WAY
SINGAPORE 349249
SINGAPORE 349249

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