Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 011410/0227 | |
| Pages: | 4 |
| | Recorded: | 12/26/2000 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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10/10/2000
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Application #:
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09136790
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Filing Dt:
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08/19/1998
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Title:
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SEMI-CONDUCTOR MOUNTING APPARATUS FOR APPLYING ADHESSIVE TO A SUBSTRATE
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Patent #:
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Issue Dt:
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01/30/2001
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Application #:
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09175204
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Filing Dt:
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10/19/1998
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Title:
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METHOD AND APPARATUS FOR ALIGNING THE BONDING HEAD OF A BONDER, IN PARTICULAR A DIE BONDER
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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09205001
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Filing Dt:
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12/02/1998
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Title:
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SEMICONDUCTOR MOUNTING APPARATUS WITH A CHIP GRIPPER TRAVELLING BACK AND FORTH
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09227279
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Filing Dt:
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01/07/1999
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Title:
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METHOD OF MAKING WIRE CONNECTIONS OF PREDETERMINED SHAPE
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Patent #:
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Issue Dt:
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10/24/2000
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Application #:
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09232016
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Filing Dt:
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01/14/1999
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Title:
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ULTRASONIC TRANSDUCER WITH A FLANGE FOR MOUNTING ON AN ULTRASONIC WELDING DEVICE, IN PARTICULAR ON A WIRE BONDER
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Patent #:
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Issue Dt:
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09/19/2000
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Application #:
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09247325
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Filing Dt:
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02/10/1999
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Title:
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METHOD FOR PRODUCING WIRE CONNECTIONS ON SEMICONDUCTOR CHIPS
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Assignee
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| HINTERBERGSTRASSE 32 |
| CHAM, SWITZERLAND CH-63 |
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Correspondence name and address
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D'ALESSANDRO & RITCHIE
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DAVID B. RITCHIE
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P.O. BOX 640640
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SAN JOSE, CA 95164-0640
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