Patent Assignment Details
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| Reel/Frame: | 008456/0228 | |
| Pages: | 3 |
| | Recorded: | 02/11/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/06/1999
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Application #:
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08798260
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Filing Dt:
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02/11/1997
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Title:
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METHOD OF INSPECTING INTEGRATED CIRCUIT SOLDER JOINTS WITH X-RAY DETECTABLE ENCAPSULANT
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Assignee
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| ERC MAIL STOP D-32 |
| KOKOMO, INDIANA 46904 |
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Correspondence name and address
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MARY S. MOORE
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DELCO ELECTRONICS CORPORATION
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P.O. BOX 9005
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ERC BUILDING, MAIL STOP D-32
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KOKOMO, IN 46904
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