Patent Assignment Details
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Reel/Frame: | 014760/0228 | |
| Pages: | 4 |
| | Recorded: | 12/08/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/30/2004
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Application #:
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10382029
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Filing Dt:
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03/04/2003
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Publication #:
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Pub Dt:
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09/11/2003
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Title:
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WAFER LEVEL CHIP-SCALE PACKAGE
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Assignee
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26 CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE KAOSHIUNG |
KAOSHIUNG, TAIWAN R.O.C. |
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Correspondence name and address
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SEYFARTH SHAW LLP
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HAROLD V. STOTLAND
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55 EAST MONROE STREET
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SUITE 4200
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CHICAGO, IL 60603-5803
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