Patent Assignment Details
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| Reel/Frame: | 021932/0228 | |
| Pages: | 5 |
| | Recorded: | 12/05/2008 | | |
| Attorney Dkt #: | 001333/0021 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/03/2010
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Application #:
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12279519
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Filing Dt:
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12/05/2008
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Publication #:
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Pub Dt:
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04/09/2009
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Title:
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DICING DIE ATTACHMENT FILM AND METHOD FOR PACKAGING SEMICONDUCTOR USING SAME
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Assignee
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| 19-20F ASEM TOWER 159 |
| SAMSUNG-DONG, GANGNAM-GU |
| SEOUL, KOREA, REPUBLIC OF 135-090 |
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Correspondence name and address
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STROOCK & STROOCK & LAVAN LLP
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180 MAIDEN LANE
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NEW YORK, NY 10038
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