Patent Assignment Details
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Reel/Frame: | 010789/0230 | |
| Pages: | 2 |
| | Recorded: | 05/05/2000 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/05/2001
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Application #:
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09565452
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Filing Dt:
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05/05/2000
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Title:
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Method for packaging a semiconductor chip
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Assignee
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26, CHIN 3RD RD., 811 NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C |
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Correspondence name and address
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BIRCH, STEWART ET AL
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P.O. BOX 747
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FALLS CHURCH, VA 22040-0747
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