Patent Assignment Details
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Reel/Frame: | 011577/0230 | |
| Pages: | 2 |
| | Recorded: | 02/15/2001 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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09784864
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Filing Dt:
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02/15/2001
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Publication #:
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Pub Dt:
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07/26/2001
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Title:
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Process to improve adhesion of cap layers in integrated circuits
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Assignee
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580 WHITE PLAINS ROAD |
TARRYTOWN, NEW YORK 10591 |
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Correspondence name and address
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OPPENHEIMER WOLFF & DONNELLY, LLP
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ROBERT D. HAYDEN
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P.O. BOX 52037
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PALO ALTO, CA 94303-0746
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