Patent Assignment Details
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| Reel/Frame: | 035259/0233 | |
| Pages: | 3 |
| | Recorded: | 03/26/2015 | | |
| Attorney Dkt #: | 814782 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/28/2017
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Application #:
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14669033
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Filing Dt:
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03/26/2015
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Publication #:
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Pub Dt:
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10/08/2015
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Title:
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METHOD FOR SLICING WAFERS FROM A WORKPIECE USING A SAWING WIRE
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Assignee
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| HANNS-SEIDEL-PLATZ 4 |
| MUNICH, GERMANY 81737 |
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Correspondence name and address
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LEYDIG, VOIT & MAYER, LTD.
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AM BURGFRIEDEN 2
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180 NORTH STETSON AVENUE
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CHICAGO, IL 606016731
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09/25/2024 06:57 PM
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