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Reel/Frame:023841/0236   Pages: 10
Recorded: 01/25/2010
Attorney Dkt #:FIS920090036US1
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
12692983
Filing Dt:
01/25/2010
Publication #:
Pub Dt:
07/28/2011
Title:
METHOD OF PRODUCING BONDED WAFER STRUCTURE WITH BURIED OXIDE/NITRIDE LAYERS
Assignors
1
Exec Dt:
12/02/2009
2
Exec Dt:
12/10/2009
3
Exec Dt:
12/09/2009
4
Exec Dt:
12/10/2009
5
Exec Dt:
12/16/2009
6
Exec Dt:
12/02/2009
7
Exec Dt:
12/18/2009
Assignee
1
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondence name and address
INTERNATIONAL BUSINESS MACHINES CORPORAT
2070 ROUTE 52, BLDG. 321-482
WENJIE LI
HOPEWELL JUNCTION, NY 12533

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