Patent Assignment Details
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Reel/Frame: | 054245/0236 | |
| Pages: | 5 |
| | Recorded: | 11/02/2020 | | |
Attorney Dkt #: | 2017-2158/24061.3629US03 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/14/2022
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Application #:
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17087174
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Filing Dt:
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11/02/2020
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Publication #:
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Pub Dt:
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02/18/2021
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Title:
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Prevention of Contact Bottom Void in Semiconductor Fabrication
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Assignee
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8, LI-HSIN RD. 6 |
HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HAYNES AND BOONE, LLP (24061) IP SECTION
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2323 VICTORY AVENUE
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SUITE 700
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DALLAS, TX 75219
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05/30/2024 07:46 AM
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