Patent Assignment Details
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Reel/Frame: | 008475/0239 | |
| Pages: | 3 |
| | Recorded: | 03/24/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/24/1998
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Application #:
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08775383
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Filing Dt:
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12/30/1996
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Title:
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MANUFACTURING PROCESS OF CONNECTING ROD ASSEMBLY AND COMPACTING DIE
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Assignee
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MATSUDO-SHI |
520 MINORIDAI |
CHIBA-KEN, JAPAN 271 |
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Correspondence name and address
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MCDONNELL BOEHNEN HULBERT & BERGHOFF
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MICHAEL S. GREENFIELD
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300 SOUTH WACKER DRIVE
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CHICAGO, IL 60606
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