Patent Assignment Details
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| Reel/Frame: | 034952/0239 | |
| Pages: | 4 |
| | Recorded: | 02/12/2015 | | |
| Attorney Dkt #: | JCLA52780 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/07/2016
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Application #:
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14620947
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Filing Dt:
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02/12/2015
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Title:
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WIRE BONDING METHOD AND CHIP STRUCTURE
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Assignee
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| 1F., NO. 669, FUXING 3RD ROAD., GUISHAN DIST. |
| TAOYUAN CITY, TAIWAN 333 |
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Correspondence name and address
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J.C. PATENTS
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4 VENTURE, SUITE 250
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IRVINE, CA 92618
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