Patent Assignment Details
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| Reel/Frame: | 014690/0240 | |
| Pages: | 2 |
| | Recorded: | 11/10/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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10703453
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Filing Dt:
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11/10/2003
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Title:
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FABRICATION METHOD OF SUB-RESOLUTION PITCH FOR INTEGRATED CIRCUITS
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Assignee
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| NO. 16, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| TAIWAN, KOREA, REPUBLIC OF R.O.C. |
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Correspondence name and address
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FINNEGAN, HENDERSON, FARABOW ET AL.
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YITAI HU
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1300 I STREET, N.W., STE. 700
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WASHINGTON, D.C. 20005-3315
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