Patent Assignment Details
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Reel/Frame: | 049692/0241 | |
| Pages: | 7 |
| | Recorded: | 07/08/2019 | | |
Attorney Dkt #: | 010829-9182.US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/09/2021
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Application #:
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16505434
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Filing Dt:
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07/08/2019
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Publication #:
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Pub Dt:
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10/31/2019
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Title:
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METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL FORMED IN ENCAPSULANT
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Assignee
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8000 S. FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83707-0006 |
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Correspondence name and address
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PERKINS COIE LLP - MICRON PATENT-SEA
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PO BOX 1247
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SEATTLE, WA 98111-1247
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06/19/2024 09:38 PM
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