Patent Assignment Details
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Reel/Frame: | 027339/0242 | |
| Pages: | 2 |
| | Recorded: | 12/06/2011 | | |
Attorney Dkt #: | ASE2412 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/04/2014
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Application #:
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13311364
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Filing Dt:
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12/05/2011
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Publication #:
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Pub Dt:
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07/12/2012
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Title:
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SEMICONDUCTOR PACKAGE WITH THROUGH SILICON VIAS AND METHOD FOR MAKING THE SAME
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Assignee
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NO. 26, CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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Correspondence name and address
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GEORGE D. MORGAN
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4635 S. LAKESHORE DR., SUITE 131
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TEMPE, AZ 85282
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