USPTO Assignments on the Web

	United States Patent and Trademark Office
	Home\|Site Index\|Search\|Guides\|Contacts\|eBusiness\|eBiz alerts\|News\|Help

Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	004993/0243			Pages:	13
		Recorded:	10/26/1988
Conveyance:	SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).

Total properties: 14

Patent #:	3634927	Issue Dt:		Application #:	04779674	Filing Dt:
Title:

Patent #:	3675090	Issue Dt:		Application #:	04867341	Filing Dt:
Title:

Patent #:	3699543	Issue Dt:		Application #:	04887076	Filing Dt:
Title:

Patent #:	4390969	Issue Dt:	06/28/1983	Application #:	06142608	Filing Dt:	04/21/1980
Title:	ASYNCHRONOUS DATA TRANSMISSION SYSTEM WITH STATE VARIABLE MEMORY AND HANDSHAKING PROTOCOL CIRCUITS

Patent #:	4479088	Issue Dt:	10/23/1984	Application #:	06225580	Filing Dt:	01/16/1981
Title:	WAFER INCLUDING TEST LEAD CONNECTED TO GROUD FOR TESTING NETWORKS THEREON

Patent #:	4453251	Issue Dt:	06/05/1984	Application #:	06310461	Filing Dt:	10/13/1981
Title:	ERROR-CORRECTING MEMORY WITH LOW STORAGE OVERHEAD AND FAST CORRECTION MECHANISM

Patent #:	4528647	Issue Dt:	07/09/1985	Application #:	06316016	Filing Dt:	10/28/1981
Title:	WAFER SCALE INTEGRATED CIRCUIT MEMORIES

Patent #:	4435498	Issue Dt:	03/06/1984	Application #:	06328339	Filing Dt:	12/07/1981
Title:	MANUFACTURE OF WAFER-SCALE INTEGRATED CIRCUITS

Patent #:	4493055	Issue Dt:	01/08/1985	Application #:	06330539	Filing Dt:	12/14/1981
Title:	WAFER-SCALE INTEGRATED CIRCUITS

Patent #:	4467400	Issue Dt:	08/21/1984	Application #:	06378023	Filing Dt:	05/13/1982
Title:	WAFER SCALE INTEGRATED CIRCUIT

Patent #:	4458297	Issue Dt:	07/03/1984	Application #:	06445156	Filing Dt:	11/29/1982
Title:	UNIVERSAL INTERCONNECTION SUBSTRATE

Patent #:	4847732	Issue Dt:	07/11/1989	Application #:	07204997	Filing Dt:	06/08/1988
Title:	WAFER AND METHOD OF MAKING SAME

Patent #:	4845315	Issue Dt:	07/04/1989	Application #:	07206955	Filing Dt:	06/09/1988
Title:	CABLE SYSTEM

Patent #:	4920454	Issue Dt:	04/24/1990	Application #:	07217146	Filing Dt:	07/01/1988
Title:	WAFER SCALE PACKAGE SYSTEM AND HEADER AND METHOD OF MANUFACTURE THEREOF

Assignor

Exec Dt:

08/26/1988

Assignee

Correspondence name and address
	PEPPER, HAMILTON & SCHEETZ
	1300 NINETEENTH STREET, N.W.
	WASHINGTON, D.C. 20036

Search Results as of: 06/24/2024 06:39 AM

If you have any comments or questions concerning the data displayed, contact PRD / Assignments at 571-272-3350. v.2.6

Web interface last modified: August 25, 2017 v.2.6