Patent Assignment Details
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| Reel/Frame: | 011635/0244 | |
| Pages: | 3 |
| | Recorded: | 03/22/2001 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/02/2002
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Application #:
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09815241
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Filing Dt:
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03/22/2001
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Title:
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Method for producing a flip chip package
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Assignee
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| #03-01/03 |
| 33 MARSILING INDUSTRIAL ESTATE ROAD 3 |
| SINGAPORE, SINGAPORE 73925 |
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Correspondence name and address
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LIU & LIU LLP
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WEN LIU
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811 WEST 7TH STREET, SUITE 1100
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LOS ANGELES, CA 90017
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