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Reel/Frame:049403/0244   Pages: 8
Recorded: 06/06/2019
Attorney Dkt #:095714-0677
Conveyance: CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PREVIOUSLY RECORDED AT REEL: 045394 FRAME: 0562. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Total properties: 1
1
Patent #:
10354874
Issue Dt:
07/16/2019
Application #:
15812750
Filing Dt:
11/14/2017
Publication #:
US20190148145
Pub Dt:
05/16/2019
Title:
DIRECTIONAL PROCESSING TO REMOVE A LAYER OR A MATERIAL FORMED OVER A SUBSTRATE
Assignors
1
HUANG, SHIH-CHUN
Exec Dt:
05/27/2019
2
LIN, CHIN-HSIANG
Exec Dt:
05/27/2019
3
LAI, CHIEN-WEN
Exec Dt:
05/27/2019
4
LIU, RU-GUN
Exec Dt:
05/27/2019
5
LIN, WEI-LIANG
Exec Dt:
05/27/2019
6
CHANG, YA HUI
Exec Dt:
05/27/2019
7
YEN, YUNG-SUNG
Exec Dt:
05/27/2019
8
SHEN, YU-TIEN
Exec Dt:
05/27/2019
9
YEH, YA-WEN
Exec Dt:
05/27/2019
Assignee
1
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK
HSINCHU, TAIWAN 300
Correspondence name and address
MCDERMOTT WILL & EMERY LLP
THE MCDERMOTT BUILDING
500 NORTH CAPITOL STREET, N.W.
WASHINGTON, DC 20001

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