Patent Assignment Details
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Reel/Frame: | 007810/0249 | |
| Pages: | 4 |
| | Recorded: | 12/12/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/21/1998
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Application #:
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08570849
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Filing Dt:
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12/12/1995
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Title:
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BONDING METHOD FOR SEMICONDUCTOR CHIPS
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Assignees
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280-B SUNGSU 2-GA, SUNGDONG-KU |
SEOUL 133-120, KOREA, REPUBLIC OF |
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1347 N. ALMA SCHOOL ROAD, SUITE 100 |
CHANDLER, ARIZONA 85224 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON ET AL.
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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