Patent Assignment Details
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| Reel/Frame: | 048181/0249 | |
| Pages: | 5 |
| | Recorded: | 01/29/2019 | | |
| Attorney Dkt #: | AOS-P109D1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/13/2021
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Application #:
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16261517
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Filing Dt:
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01/29/2019
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Publication #:
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Pub Dt:
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05/23/2019
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Title:
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WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignee
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| ZEPHYR HOUSE |
| 122 MARY STREET, P.O. BOX 709 |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1107 |
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Correspondence name and address
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CHEN-CHI LIN
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1119 QUAIL CREEK CIRCLE
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SAN JOSE, CA 95120
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