Patent Assignment Details
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Reel/Frame: | 012583/0251 | |
| Pages: | 2 |
| | Recorded: | 02/11/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/04/2003
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Application #:
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10068878
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Filing Dt:
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02/11/2002
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Publication #:
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Pub Dt:
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08/15/2002
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Title:
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METHOD FOR MANUFACTURING CONDUCTIVE ADHESIVE FOR HIGH FREQUENCY FLIP CHIP PACKAGE APPLICATION
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Assignee
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373-1, KUSONG-DONG |
YUSONG-GU, TAEJON 305-701, KOREA, REPUBLIC OF |
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Correspondence name and address
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OLIFF & BERRIDGE PLC
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JAMES A. OLIFF
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P.O. BOX 19928
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ALEXANDRIA, VA 22320
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