Patent Assignment Details
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Reel/Frame: | 005606/0254 | |
| Pages: | 2 |
| | Recorded: | 02/06/1991 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/23/1992
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Application #:
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07639237
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Filing Dt:
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01/09/1991
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Title:
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METHOD OF BALL BONDING TO NON-WIRE BONDED ELECTRODES OF SEMICONDUCTOR DEVICES
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Assignee
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2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, |
TOKYO,, JAPAN |
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Correspondence name and address
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JEFFREY A. WYAND
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LEYDIG, VOIT & MAYER
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STE. 300, 700 THIRTEENTH ST., NW
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WASHINGTON, DC 20005
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