Patent Assignment Details
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Reel/Frame: | 027856/0257 | |
| Pages: | 4 |
| | Recorded: | 03/13/2012 | | |
Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/18/1997
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Application #:
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08587830
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Filing Dt:
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01/11/1996
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Title:
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METHOD OF ASSEMBLING AND COOLING A PACKAGE STRUCTURE WITH ACCESSIBLE CHIP
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Assignee
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1251 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10020 |
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Correspondence name and address
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DAVID L. SCHAEFFER
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411 EAST PLUMERIA DRIVE, MS41
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NXP SEMICONDUCTORS, IP&L
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SAN JOSE, CA 95134
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