Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 016561/0260 | |
| Pages: | 4 |
| | Recorded: | 07/22/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
12
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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09466895
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Filing Dt:
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12/20/1999
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Title:
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METHOD FOR FABRICATING A WIRING SUBSTRATE
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Patent #:
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Issue Dt:
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03/04/2003
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Application #:
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09685799
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Filing Dt:
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10/11/2000
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Title:
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WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
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Patent #:
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Issue Dt:
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09/09/2003
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Application #:
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10072351
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Filing Dt:
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02/07/2002
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Publication #:
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Pub Dt:
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07/04/2002
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Title:
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FABRICATION METHOD OF WIRING SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
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Patent #:
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Issue Dt:
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12/07/2004
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Application #:
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10139237
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Filing Dt:
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05/07/2002
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Publication #:
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Pub Dt:
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07/31/2003
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Title:
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MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATES
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Patent #:
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Issue Dt:
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11/11/2003
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Application #:
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10287633
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Filing Dt:
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11/05/2002
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Publication #:
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Pub Dt:
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08/14/2003
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Title:
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WIRING CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREFOR
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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10358229
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Filing Dt:
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02/05/2003
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Publication #:
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Pub Dt:
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08/21/2003
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Title:
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CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10450844
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Filing Dt:
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06/26/2003
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Publication #:
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Pub Dt:
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05/12/2005
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Title:
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Multi-layer wiring board, method for producing multi-layer wiring board, polishing machine for multi-layer wiring board, and metal sheet for producing wiring board
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10812349
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Filing Dt:
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03/30/2004
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Publication #:
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Pub Dt:
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10/14/2004
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Title:
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Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10823611
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Filing Dt:
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04/14/2004
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Publication #:
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Pub Dt:
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10/07/2004
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Title:
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MANUFACTURING METHOD FOR WIRING CIRCUIT SUBSTRATE
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Patent #:
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Issue Dt:
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03/11/2008
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Application #:
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10880588
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Filing Dt:
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07/01/2004
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Publication #:
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Pub Dt:
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01/06/2005
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Title:
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MULTILAYER WIRING BOARD FOR AN ELECTRONIC DEVICE
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Patent #:
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Issue Dt:
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07/03/2007
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Application #:
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11029423
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Filing Dt:
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01/06/2005
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Publication #:
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Pub Dt:
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07/28/2005
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Title:
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CONNECTING MEMBER BETWEEN WIRING FILMS, MANUFACTURING METHOD THEREOF, AND MANUFACTURING METHOD OF MULTILAYER WIRING SUBSTRATE
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11085108
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Filing Dt:
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03/22/2005
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Publication #:
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Pub Dt:
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10/13/2005
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Title:
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Interlayer member used for producing multilayer wiring board and method of producing the same
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Assignee
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3099 ORCHARD DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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Correspondence name and address
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DARYL K. NEFF
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LERNER, DAVID, LITTENBERG, ET AL.
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600 SOUTH AVENUE WEST
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WESTFIELD, NJ 07090
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