Patent Assignment Details
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| Reel/Frame: | 039301/0260 | |
| Pages: | 8 |
| | Recorded: | 07/11/2016 | | |
| Attorney Dkt #: | 092990D1 |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE INSIDE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED AT REEL: 038581 FRAME: 0367. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT . |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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10278106
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Filing Dt:
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10/22/2002
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Publication #:
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Pub Dt:
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03/27/2003
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Title:
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POST PASSIVATION INTERCONNECTION SCHEMES ON TOP OF THE IC CHIPS
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Assignee
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| 21 R & D FIRST ROAD |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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Correspondence name and address
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MEGIC CORPORATION
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21 R & D FIRST ROAD
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SCIENCE BASED INDUSTRIAL PARK
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HSIN-CHU, TAIWAN
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