Patent Assignment Details
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| Reel/Frame: | 017041/0262 | |
| Pages: | 2 |
| | Recorded: | 09/28/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10529811
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Filing Dt:
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09/27/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof
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Assignee
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| 3, ESPLANADE DU FONCET |
| ISSY-LES-MOULINEAUX CEDEX, FRANCE F-92442 |
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Correspondence name and address
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DAVID D. BRUSH
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WESTMAN, CHAMPLIN & KELLY, P.A.
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SUITE 1600, 900 SECOND AVENUE SOUTH
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INTERNATIONAL CENTRE
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MINNEAPOLIS, MN 55402
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