Patent Assignment Details
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| Reel/Frame: | 006696/0266 | |
| Pages: | 3 |
| | Recorded: | 09/20/1993 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/30/1994
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Application #:
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08088113
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Filing Dt:
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07/09/1993
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Title:
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PROCESS FOR OBTAINING MULTI-LAYER METALLIZATION OF THE BACK OF A SEMICONDUCTOR SUBSTRATE
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Assignee
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| VIA C. OLIVETTI N.2 |
| AGRATE BRIANZA MI, ITALY 20041 |
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Correspondence name and address
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HENRY M. ZYKORIE
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WENDEROTH LIND & PONACK
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805 15TH STREET, N.W., SUITE 700
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WASHINGTON, DC 20005
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