Patent Assignment Details
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| Reel/Frame: | 065646/0267 | |
| Pages: | 4 |
| | Recorded: | 11/22/2023 | | |
| Attorney Dkt #: | P20210316US02 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18517457
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Filing Dt:
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11/22/2023
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Publication #:
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Pub Dt:
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03/14/2024
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Title:
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SEMICONDUCTOR SUBSTRATE BONDING TOOL AND METHODS OF OPERATION
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Assignee
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| 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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Correspondence name and address
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HARRITY & HARRITY, LLP
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11350 RANDOM HILLS ROAD
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SUITE 600
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FAIRFAX, VA 22030
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05/25/2024 02:04 AM
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