Patent Assignment Details
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Reel/Frame: | 004598/0268 | |
| Pages: | 2 |
| | Recorded: | 09/03/1986 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/23/1988
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Application #:
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06904437
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Filing Dt:
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09/08/1986
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Title:
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RIE PROCESS FOR ETCHING SILICON ISOLATION TRENCHES AND POLYCIDES WITH VERTICAL SURFACES
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Correspondence name and address
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T. RAO COCA
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IBM CORPORATION
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DEPT. 901/BLDG. 300-482
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HOPEWELL JUNCTION, NY 12533-9988
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