Patent Assignment Details
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Reel/Frame: | 036499/0268 | |
| Pages: | 3 |
| | Recorded: | 09/04/2015 | | |
Attorney Dkt #: | 27283US02 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/03/2018
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Application #:
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14846543
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Filing Dt:
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09/04/2015
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Title:
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EMBEDDED COMPONENT PACKAGE AND FABRICATION METHOD
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Assignee
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2045 E. INNOVATION CIRCLE |
TEMPE, ARIZONA 85284 |
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Correspondence name and address
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AMKOR TECHNOLOGY, INC. C/O MCANDREWS, HE
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500 WEST MADISON ST., FLOOR 34
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CHICAGO, IL 60661
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