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Reel/Frame:031432/0270   Pages: 8
Recorded: 10/18/2013
Attorney Dkt #:TSMCP326US
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
12/22/2015
Application #:
14057117
Filing Dt:
10/18/2013
Publication #:
Pub Dt:
04/23/2015
Title:
INDIRECT PRINTING BUMPING METHOD FOR SOLDER BALL DEPOSITION
Assignors
1
Exec Dt:
10/07/2013
2
Exec Dt:
10/07/2013
3
Exec Dt:
10/07/2013
4
Exec Dt:
10/07/2013
Assignee
1
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
ESCHWEILER & ASSOCIATES, LLC.
629 EUCLID AVENUE, SUITE 1000
NATIONAL CITY BANK BUILDING
CLEVELAND, OH 44114

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