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Patent Assignment Details
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Reel/Frame:007611/0271   Pages: 5
Recorded: 07/31/1995
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
05/20/1997
Application #:
08509378
Filing Dt:
07/31/1995
Title:
LEAD WITH SLITS FOR REDUCING SOLDER OVERFLOW AND ELIMINATING AIR GAPS IN THE EXECUTION OF SOLDER JOINTS
Assignors
1
Exec Dt:
07/07/1995
2
Exec Dt:
07/07/1995
3
Exec Dt:
07/07/1995
Assignee
1
2200 BYBERRY ROAD
HATBORO, PENNSYLVANIA 19040
Correspondence name and address
JAMES & FRANKLIN
ROBERT L. EPSTEIN, ESQ.
60 EAST 42ND STREET
SUITE 1217
NEW YORK, NY 10165

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