Patent Assignment Details
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Reel/Frame: | 007611/0271 | |
| Pages: | 5 |
| | Recorded: | 07/31/1995 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/20/1997
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Application #:
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08509378
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Filing Dt:
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07/31/1995
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Title:
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LEAD WITH SLITS FOR REDUCING SOLDER OVERFLOW AND ELIMINATING AIR GAPS IN THE EXECUTION OF SOLDER JOINTS
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Assignee
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2200 BYBERRY ROAD |
HATBORO, PENNSYLVANIA 19040 |
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Correspondence name and address
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JAMES & FRANKLIN
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ROBERT L. EPSTEIN, ESQ.
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60 EAST 42ND STREET
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SUITE 1217
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NEW YORK, NY 10165
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