Patent Assignment Details
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Reel/Frame: | 013086/0271 | |
| Pages: | 3 |
| | Recorded: | 07/10/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10191071
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Filing Dt:
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07/10/2002
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Publication #:
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Pub Dt:
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01/15/2004
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Title:
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Fabrication method of substrate on chip CA ball grid array package
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Assignee
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SCIENCE-BASED INDUSTRIAL PARK |
NO. 9, LI-HSIN RD. V. |
HSINCHU, TAIWAN R.O.C |
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Correspondence name and address
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ROSENBERG, KLEIN & LEE
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MORTON J. ROSENBERG
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3458 ELLICOTT CENTER DR., STE. 101
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ELLICOTT CITY, MD 21043
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