Patent Assignment Details
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Reel/Frame: | 053692/0271 | |
| Pages: | 5 |
| | Recorded: | 09/04/2020 | | |
Attorney Dkt #: | RONDAUSIP0041 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/28/2021
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Application #:
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16978197
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Filing Dt:
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09/04/2020
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Publication #:
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Pub Dt:
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02/11/2021
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Title:
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SOLDER PREFORM
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Assignee
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NO. 58, NANYUN 2 ROAD, SCIENCE CITY, GUANGZHOU HI-TECH INDUSTRIAL DEVELOPMENT ZONE |
GUANGZHOU, GUANGDONG, CHINA |
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Correspondence name and address
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JIE YANG
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P. O. BOX 30 PAINTED POST
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NY, NY 14870
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09/21/2024 11:11 AM
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