Patent Assignment Details
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Reel/Frame: | 013716/0273 | |
| Pages: | 3 |
| | Recorded: | 01/27/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10351855
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Filing Dt:
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01/27/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Title:
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Solder-fill and its manufacturing method for using semiconductor package and its application for mounting semiconductor chip on PCB
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Assignee
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SAN 56-1, SHINLIM DONG |
RM #302-427 MECHANICAL AND AEROSPACE ENGINEERING |
KWANAK GU, SEOUL, KOREA, REPUBLIC OF |
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Correspondence name and address
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PETER T. KWON
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KANGNAM P.O. BOX 2301
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SEOUL, REPUBLIC OF KOREA 135-242
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