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Reel/Frame:023056/0273   Pages: 4
Recorded: 08/05/2009
Attorney Dkt #:051876.G019
Conveyance: NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
Total properties: 8
1
Patent #:
Issue Dt:
12/14/1999
Application #:
08687929
Filing Dt:
07/29/1996
Title:
CHIP CARRIER WITH EMBEDDED LEADS AND CHIP PACKAGE USING SAME
2
Patent #:
Issue Dt:
03/02/1999
Application #:
08749963
Filing Dt:
11/18/1996
Title:
PLATE AND COLUMN TYPE SEMICONDUCTOR PACKAGE HAVING HEAT SINK
3
Patent #:
Issue Dt:
07/25/2000
Application #:
08785019
Filing Dt:
01/17/1997
Title:
LEAD FRAME HAVING SUPPORTERS AND SEMICONDUCTOR PACKAGE USING SAME
4
Patent #:
Issue Dt:
04/27/1999
Application #:
08785592
Filing Dt:
01/17/1997
Title:
LEAD FRAME AND SEMICONDUCTOR PACKAGE
5
Patent #:
Issue Dt:
01/09/2001
Application #:
09233463
Filing Dt:
01/20/1999
Title:
DEVICE ISOLATION STRUCTURE AND DEVICE ISOLATION METHOD FOR A SEMICONDUCTOR POWER INTEGRATED CIRCUIT
6
Patent #:
Issue Dt:
01/30/2001
Application #:
09412646
Filing Dt:
10/05/1999
Title:
SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE
7
Patent #:
Issue Dt:
12/16/2003
Application #:
09415268
Filing Dt:
10/12/1999
Publication #:
Pub Dt:
11/14/2002
Title:
LEAD FRAME AND BOTTOM LEAD SEMICONDUCTOR PACKAGE USING THE LEAD FRAME
8
Patent #:
Issue Dt:
10/15/2002
Application #:
09996615
Filing Dt:
11/30/2001
Publication #:
Pub Dt:
10/31/2002
Title:
METHOD FOR FABRICATING CAPACITOR OF SEMICONDUCTOR DEVICE
Assignor
1
Exec Dt:
07/30/2009
Assignee
1
1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI
CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 361-725
Correspondence name and address
BLAKELY , SOKOLOFF, TAYLOR & ZAFMAN LLP
1279 OAKMEAD PARKWAY
SUNNYVALE, CA 94085-4040

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