Patent Assignment Details
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Reel/Frame: | 014983/0274 | |
| Pages: | 4 |
| | Recorded: | 02/10/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/05/2005
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Application #:
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10774418
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Filing Dt:
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02/10/2004
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Title:
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METHOD OF TREATING INLAID COPPER FOR IMPROVED CAPPING LAYER ADHESION WITHOUT DAMAGING POROUS LOW-K MATERIALS
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Assignee
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ONE AMD PLACE |
P.O. BOX 3453 |
SUNNYVALE, CALIFORNIA 94088-3453 |
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Correspondence name and address
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MCDERMOTT, WILL & EMERY
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600 13TH STREET, N.W.
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WASHINGTON, D.C. 20005-3096
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