Patent Assignment Details
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Reel/Frame: | 023309/0275 | |
| Pages: | 5 |
| | Recorded: | 09/30/2009 | | |
Attorney Dkt #: | 27-604.CP |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12563368
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Filing Dt:
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09/21/2009
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Publication #:
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Pub Dt:
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09/30/2010
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH AN INTEGRAL-INTERPOSER-STRUCTURE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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LAW OFFICES OF MIKIO ISHIMARU
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333 W. EL CAMINO REAL
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SUITE 330
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SUNNYVALE, CA 94087
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