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Patent Assignment Details

NOTE:Results display only for issued patents and published applications. For pending or abandoned applications please consult USPTO staff.

Reel/Frame:	021380/0276			Pages:	19
		Recorded:	08/07/2008
Conveyance:	FORECLOSURE BY SECURE NOTE HOLDERS

Total properties: 25

Patent #:	6809608	Issue Dt:	10/26/2004	Application #:	10094761	Filing Dt:	03/11/2002
Publication #:	US20030001698	Pub Dt:	01/02/2003
Title:	TRANSMISSION LINE STRUCTURE WITH AN AIR DIELECTRIC

Patent #:	6933610	Issue Dt:	08/23/2005	Application #:	10370422	Filing Dt:	02/19/2003
Publication #:	US20030205802	Pub Dt:	11/06/2003
Title:	METHOD OF BONDING A SEMICONDUCTOR DIE WITHOUT AN ESD CIRCUIT AND A SEPARATE ESD CIRCUIT TO AN EXTERNAL LEAD, AND A SEMICONDUCTOR DEVICE MADE THEREBY

Patent #:	7307293	Issue Dt:	12/11/2007	Application #:	10426930	Filing Dt:	04/29/2003
Publication #:	US20030222282	Pub Dt:	12/04/2003
Title:	DIRECT-CONNECT INTEGRATED CIRCUIT SIGNALING SYSTEM FOR BYPASSING INTRA-SUBSTRATE PRINTED CIRCUIT SIGNAL PATHS

Patent #:	6884120	Issue Dt:	04/26/2005	Application #:	10608255	Filing Dt:	06/27/2003
Title:	ARRAY CONNECTOR WITH DEFLECTABLE COUPLING STRUCTURE FOR MATING WITH OTHER COMPONENTS

Patent #:	6891272	Issue Dt:	05/10/2005	Application #:	10632730	Filing Dt:	07/31/2003
Title:	MULTI-PATH VIA INTERCONNECTION STRUCTURES AND METHODS FOR MANUFACTURING THE SAME

Patent #:	7014472	Issue Dt:	03/21/2006	Application #:	10756924	Filing Dt:	01/13/2004
Publication #:	US20050014395	Pub Dt:	01/20/2005
Title:	SYSTEM FOR MAKING HIGH-SPEED CONNECTIONS TO BOARD-MOUNTED MODULES

Patent #:	7111108	Issue Dt:	09/19/2006	Application #:	10823499	Filing Dt:	04/12/2004
Publication #:	US20040236894	Pub Dt:	11/25/2004
Title:	MEMORY SYSTEM HAVING A MULTIPLEXED HIGH-SPEED CHANNEL

Patent #:	7701323	Issue Dt:	04/20/2010	Application #:	10857830	Filing Dt:	06/01/2004
Title:	LOW PROFILE DISCRETE ELECTRONIC COMPONENTS AND APPLICATIONS OF SAME

Patent #:	7061096	Issue Dt:	06/13/2006	Application #:	10947686	Filing Dt:	09/23/2004
Publication #:	US20050093127	Pub Dt:	05/05/2005
Title:	MULTI-SURFACE IC PACKAGING STRUCTURES AND METHODS FOR THEIR MANUFACTURE

Patent #:	7732904	Issue Dt:	06/08/2010	Application #:	10964578	Filing Dt:	10/12/2004
Publication #:	US20050093152	Pub Dt:	05/05/2005
Title:	MULTI-SURFACE CONTACT IC PACKAGING STRUCTURES AND ASSEMBLIES

Patent #:	7176580	Issue Dt:	02/13/2007	Application #:	10973172	Filing Dt:	10/25/2004
Title:	STRUCTURES AND METHODS FOR WIRE BONDING OVER ACTIVE, BRITTLE AND LOW K DIELECTRIC AREAS OF AN IC CHIP

Patent #:	7279783	Issue Dt:	10/09/2007	Application #:	10977355	Filing Dt:	10/29/2004
Title:	PARTITIONED INTEGRATED CIRCUIT PACKAGE WITH CENTRAL CLOCK DRIVER

Patent #:	7388279	Issue Dt:	06/17/2008	Application #:	10987187	Filing Dt:	11/12/2004
Publication #:	US20050133922	Pub Dt:	06/23/2005
Title:	TAPERED DIELECTRIC AND CONDUCTOR STRUCTURES AND APPLICATIONS THEREOF

Patent #:	7280372	Issue Dt:	10/09/2007	Application #:	10990280	Filing Dt:	11/15/2004
Publication #:	US20050103522	Pub Dt:	05/19/2005
Title:	STAIR STEP PRINTED CIRCUIT BOARD STRUCTURES FOR HIGH SPEED SIGNAL TRANSMISSIONS

Patent #:	7205613	Issue Dt:	04/17/2007	Application #:	11033354	Filing Dt:	01/07/2005
Publication #:	US20050146821	Pub Dt:	07/07/2005
Title:	INSULATING SUBSTRATE FOR IC PACKAGES HAVING INTEGRAL ESD PROTECTION

Patent #:	7652381	Issue Dt:	01/26/2010	Application #:	11055578	Filing Dt:	02/09/2005
Publication #:	US20050189640	Pub Dt:	09/01/2005
Title:	INTERCONNECT SYSTEM WITHOUT THROUGH-HOLES

Patent #:	7845986	Issue Dt:	12/07/2010	Application #:	11123863	Filing Dt:	05/06/2005
Publication #:	US20060035482	Pub Dt:	02/16/2006
Title:	TORSIONALLY-INDUCED CONTACT-FORCE CONDUCTORS FOR ELECTRICAL CONNECTOR SYSTEMS

Patent #:	7750446	Issue Dt:	07/06/2010	Application #:	11182484	Filing Dt:	07/14/2005
Publication #:	US20060091507	Pub Dt:	05/04/2006
Title:	IC PACKAGE STRUCTURES HAVING SEPARATE CIRCUIT INTERCONNECTION STRUCTURES AND ASSEMBLIES CONSTRUCTED THEREOF

Patent #:	7737545	Issue Dt:	06/15/2010	Application #:	11353564	Filing Dt:	02/13/2006
Publication #:	US20060157846	Pub Dt:	07/20/2006
Title:	MULTI-SURFACE IC PACKAGING STRUCTURES AND METHODS FOR THEIR MANUFACTURE

Patent #:	7466021	Issue Dt:	12/16/2008	Application #:	11381357	Filing Dt:	05/02/2006
Publication #:	US20060244150	Pub Dt:	11/02/2006
Title:	MEMORY PACKAGES HAVING STAIR STEP INTERCONNECTION LAYERS

Patent #:	7613011	Issue Dt:	11/03/2009	Application #:	11748045	Filing Dt:	05/14/2007
Publication #:	US20070236901	Pub Dt:	10/11/2007
Title:	SIGNAL-SEGREGATING CONNECTOR SYSTEM

Patent #:	7651336	Issue Dt:	01/26/2010	Application #:	11868947	Filing Dt:	10/08/2007
Publication #:	US20090093173	Pub Dt:	04/09/2009
Title:	HIGH SPEED, DIRECT PATH, STAIR-STEP, ELECTRONIC CONNECTORS WITH IMPROVED SIGNAL INTEGRITY CHARACTERISTICS AND METHODS FOR THEIR MANUFACTURE

Patent #:	NONE	Issue Dt:		Application #:	11868963	Filing Dt:	10/09/2007
Publication #:	US20090091017	Pub Dt:	04/09/2009
Title:	Partitioned Integrated Circuit Package with Central Clock Driver

Patent #:	7989929	Issue Dt:	08/02/2011	Application #:	11930217	Filing Dt:	10/31/2007
Publication #:	US20090108416	Pub Dt:	04/30/2009
Title:	DIRECT-CONNECT SIGNALING SYSTEM

Assignor

Exec Dt:

01/07/2008

Assignee

922 SOUTH DE ANZA BLVD., SUITE 201

SAN JSOE, CALIFORNIA 95129

Correspondence name and address
	RONALD R. SHEA, ESQ.
	2540 COUNTRY HILLS RD., APT. 192
	BREA, CA 92821

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