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Reel/Frame:031299/0277   Pages: 2
Recorded: 09/27/2013
Attorney Dkt #:T5057-939
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/01/2016
Application #:
14039481
Filing Dt:
09/27/2013
Publication #:
Pub Dt:
04/02/2015
Title:
SEMICONDUCTOR DEVICE HAVING AN INTER-LAYER VIA (ILV), AND METHOD OF MAKING SAME
Assignors
1
Exec Dt:
09/16/2013
2
Exec Dt:
09/16/2013
3
Exec Dt:
09/16/2013
4
Exec Dt:
09/18/2013
Assignee
1
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondence name and address
LOWE HAUPTMAN & HAM, LLP (TSMC)
2318 MILL ROAD
SUITE 1400
ALEXANDRIA, VA 22314

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