Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 049439/0277 | |
| Pages: | 30 |
| | Recorded: | 02/27/2019 | | |
| Attorney Dkt #: | 077665-0010 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
4
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Patent #:
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Issue Dt:
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01/10/2017
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Application #:
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14893789
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Filing Dt:
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11/24/2015
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Publication #:
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Pub Dt:
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04/14/2016
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION OF SAME
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Patent #:
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Issue Dt:
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01/03/2017
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Application #:
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14893833
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Filing Dt:
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11/24/2015
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Publication #:
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Pub Dt:
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04/21/2016
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICE USE AND METHOD OF PRODUCTION OF SAME
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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15506956
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Filing Dt:
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02/27/2017
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Publication #:
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Pub Dt:
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10/05/2017
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Title:
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Cu PILLAR CYLINDRICAL PREFORM FOR SEMICONDUCTOR CONNECTION
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Patent #:
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Issue Dt:
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05/24/2022
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Application #:
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16067120
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Filing Dt:
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06/28/2018
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Publication #:
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Pub Dt:
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12/27/2018
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Title:
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BONDING WIRE FOR SEMICONDUCTOR DEVICES
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Assignee
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| 14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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Correspondence name and address
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MCDERMOTT WILL & EMERY LLP
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500 NORTH CAPITOL STREET, N.W.
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WASHINGTON, DC 20001
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