Patent Assignment Details
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| Reel/Frame: | 017177/0281 | |
| Pages: | 3 |
| | Recorded: | 01/10/2006 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/14/2008
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Application #:
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11270491
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Filing Dt:
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11/10/2005
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Publication #:
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Pub Dt:
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05/18/2006
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Title:
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METHODS FOR DICING A RELEASED CMOS-MEMS MULTI-PROJECT WAFER
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Assignee
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| 1F, NO. 1, JHANYE 1ST RD. |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY 300, TAIWAN R.O.C. |
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Correspondence name and address
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MORTON J. ROSENBERG
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ROSENBERG, KLEIN & LEE
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3458 ELLICOTT CENTER DRIVE, SUITE 101
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ELLICOTT CITY, MD 21043
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