Patent Assignment Details
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Reel/Frame: | 014816/0282 | |
| Pages: | 3 |
| | Recorded: | 08/21/2003 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10468775
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Filing Dt:
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08/21/2003
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Publication #:
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Pub Dt:
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04/15/2004
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Title:
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SEMINCONDUCTOR CHIP MANUFACTURING METHOD INCLUNDING ETCHING STEP TO REMOVE DISTORTION AND TO SEPARATE CHIPS.
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Assignee
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14-3, HIGASHI KOJIYA 2-CHOME |
OTA-KU, TOKYO 144-0033, JAPAN |
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Correspondence name and address
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WENDEROTH LIND & PONACK, LLP
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CHARLES R. WATTS, ESQ.
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2033 K STREET, N.W.
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SUITE 800
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WASHINGTON, DC 20006-1021
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