Patent Assignment Details
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Reel/Frame: | 031448/0284 | |
| Pages: | 11 |
| | Recorded: | 10/21/2013 | | |
Attorney Dkt #: | 27-894 |
Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THIRD INVENTOR'S NAME HEESO LEE PREVIOUSLY RECORDED ON REEL 031281 FRAME 0302. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/28/2015
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Application #:
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14037110
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Filing Dt:
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09/25/2013
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Publication #:
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Pub Dt:
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03/26/2015
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HEAT SPREADER AND METHOD OF MANUFACTURE THEREOF
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Assignee
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10 ANG MO KIO STREET 65 |
#05-17/20 TECHPOINT |
SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CA 95110
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