Patent Assignment Details
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| Reel/Frame: | 021808/0285 | |
| Pages: | 5 |
| | Recorded: | 11/10/2008 | | |
| Attorney Dkt #: | 08SD-002 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12267674
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Filing Dt:
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11/10/2008
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Publication #:
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Pub Dt:
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05/28/2009
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Title:
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Multilayered Circuit Board for Connection to Bumps
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Assignee
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| 80, OSHIMADA-MACHI, NAGANO-SHI |
| NAGANO, JAPAN 381-2287 |
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Correspondence name and address
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IPUSA, P.L.L.C
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1054 31ST STREET, N.W.
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SUITE 400
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WASHINGTON, DC 20007
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