Patent Assignment Details
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Reel/Frame: | 008911/0286 | |
| Pages: | 2 |
| | Recorded: | 12/05/1997 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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08985959
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Filing Dt:
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12/05/1997
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Title:
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BALL GRID ARRAY SEMICONDUCTOR PACKAGE COMPRISED OF TWO LEAD FRAMES
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Assignee
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1, HYANGJEONG-DONG, HUNGDUK-GU CHEONGJU |
CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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MORGAN, LEWIS & BOCKIUS LLP
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ROBERT J. GAYBRICK
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1800 M STREET, N.W.
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WASHINGTON, D.C. 20036
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