Patent Assignment Details
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Reel/Frame: | 016030/0286 | |
| Pages: | 7 |
| | Recorded: | 11/24/2004 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10996677
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Filing Dt:
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11/24/2004
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Publication #:
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Pub Dt:
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05/25/2006
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Title:
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Die bonded device and method for transistor packages
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Assignee
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2220 AMERICAN PARKWAY NE |
ALLENTOWN, PENNSYLVANIA 18109 |
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Correspondence name and address
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LAW FIRM OF PETER V.D. WILDE
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301 EAST LANDING
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WILLIAMSBURG, VA 23185
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