Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 028041/0286 | |
| Pages: | 3 |
| | Recorded: | 04/13/2012 | | |
| Attorney Dkt #: | 08SKY0009 US |
| Conveyance: | ACKNOWLEDGMENT AND ASSIGNMENT |
|
|
Total properties:
2
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2012
|
Application #:
|
12740922
|
Filing Dt:
|
04/30/2010
|
|
Publication #:
|
|
Pub Dt:
|
09/30/2010
| | | | |
|
Title:
|
WAFER LEVEL PACKAGING USING FLIP CHIP MOUNTING
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/04/2012
|
Application #:
|
12740922
|
Filing Dt:
|
04/30/2010
|
| | | | | | |
PCT #:
|
US2008068106
|
|
Title:
|
WAFER LEVEL PACKAGING USING FLIP CHIP MOUNTING
|
|
|
Assignee
|
|
|
|
|
| 20 SYLVAN ROAD |
| WOBURN, MASSACHUSETTS 01801 |
|
|
Correspondence name and address
|
| |
DONALD BOLLELLA
|
| |
5221 CALIFORNIA AVENUE, 21-1
|
| |
IRVINE, CA 92617
|
Search Results as of:
06/24/2024 06:10 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
