Patent Assignment Details
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Reel/Frame: | 013421/0287 | |
| Pages: | 4 |
| | Recorded: | 10/24/2002 | | |
Conveyance: | RECORD TO CORRECT THE STATE OF INCORPORATION OF THE ASSIGNEE. DOCUMENT PREVIOUSLY RECORDED AT REEL 011488 FRAME 0440. (ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE THE ENTIRE INTEREST.) |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/17/2002
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Application #:
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09770861
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Filing Dt:
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01/26/2001
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Title:
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SEMICONDUCTOR MODULE PACKAGE SUBSTRATE FABRICATION METHOD
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Assignee
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1900 SOUTH PRICE ROAD |
CHANDLER, ARIZONA 85248-1604 |
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Correspondence name and address
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GUNNISON, MCKAY & HODGSON, L.L.P.
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SERGE J. HODGSON
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1900 GARDEN ROAD, SUITE 220
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GARDEN WEST OFFICE PLAZA
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MONTEREY, CA 93940
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