Patent Assignment Details
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Reel/Frame: | 013014/0288 | |
| Pages: | 2 |
| | Recorded: | 06/19/2002 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/29/2003
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Application #:
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10101329
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Filing Dt:
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03/19/2002
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Publication #:
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Pub Dt:
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10/24/2002
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Title:
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METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH METALLIZATION LAYERS INTERCONNECTED BY TUNGSTEN PLUGS
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Assignee
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GROENEWOUDSEWEG 1 |
5621 BA EINDHOVEN, NETHERLANDS |
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Correspondence name and address
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PHILIPS ELECTRONICS NORTH AMERICA CORP.
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AARON WAXLER
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580 WHITE PLAINS ROAD
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TARRYTOWN, NY 10591
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